发明授权
US07349219B2 Memory module assembly including a clip for mounting a heat sink thereon
失效
存储器模块组件，包括用于在其上安装散热器的夹子
- 专利标题： Memory module assembly including a clip for mounting a heat sink thereon
- 专利标题（中）： 存储器模块组件，包括用于在其上安装散热器的夹子
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申请号： US11308848申请日： 2006-05-15
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公开(公告)号： US07349219B2公开(公告)日： 2008-03-25
- 发明人: Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
- 申请人： Cheng-Tien Lai , Zhi-Yong Zhou , Qiao-Li Ding
- 申请人地址： CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 专利权人： Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- 当前专利权人： Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- 当前专利权人地址： CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 代理商 Jeffrey T. Knapp
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A memory module assembly includes a printed circuit board (30) having a heat-generating electronic component (32) thereon, a heat sink (10) and a clip (20) for securing the heat sink onto the heat-generating electronic component. The heat sink includes a base (12) and a plurality of fins (14) arranged on the base. A plurality of recesses is defined in the heat sink. The clip includes a body (22) resting against a face of the printed circuit board and elastic hooks (24) extending from the body. The hooks are received in the recesses and resiliently press the base of the heat sink toward the heat-generating electronic component, whereby the clip clamps the heat sink and the printed circuit board together.
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