Invention Grant
- Patent Title: Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
- Patent Title (中): 导热材料的自定向微板作为热糊或粘合剂中的组分
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Application No.: US10986665Application Date: 2004-11-12
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Publication No.: US07351360B2Publication Date: 2008-04-01
- Inventor: Gareth Hougham , Paul A. Lauro , Brian R. Sundlof , Jeffrey D. Gelorme
- Applicant: Gareth Hougham , Paul A. Lauro , Brian R. Sundlof , Jeffrey D. Gelorme
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Connolly Boye Lodge & Hutz LLP
- Agent Daniel P. Morris
- Main IPC: H01B1/04
- IPC: H01B1/04
Abstract:
The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.
Public/Granted literature
- US20060112857A1 Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive Public/Granted day:2006-06-01
Information query
