发明授权
- 专利标题： Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarization
- 专利标题（中）： 在化学机械平面化期间催化介电膜去除速率的组成和相关方法
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申请号： US11233110申请日： 2005-09-22
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公开(公告)号： US07351662B2公开(公告)日： 2008-04-01
- 发明人: Junaid Ahmed Siddiqui , Daniel Hernandez Castillo, II , Robin Edward Richards , Timothy Frederick Compton
- 申请人： Junaid Ahmed Siddiqui , Daniel Hernandez Castillo, II , Robin Edward Richards , Timothy Frederick Compton
- 申请人地址： US AZ Tempe
- 专利权人： DuPont Air Products Nanomaterials LLC
- 当前专利权人： DuPont Air Products Nanomaterials LLC
- 当前专利权人地址： US AZ Tempe
- 代理商 Geoffrey L. Chase
- 主分类号： H01L21/302
- IPC分类号： H01L21/302
摘要：
A low solids-content slurry for polishing (e.g., chemical mechanical planarization) of substrates comprising a dielectric and an associated method using the slurry are described. The slurry and associated method afford high removal rates of dielectric during polishing even though the slurry has low solids-content. The slurry comprises a bicarbonate salt, which acts as a catalyst for increasing removal rates of dielectric films during polishing of these substrates.
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