Invention Grant
- Patent Title: Assembly and heat-dissipating device having the same assembly
- Patent Title (中): 装配和散热装置具有相同的组件
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Application No.: US11363656Application Date: 2006-02-27
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Publication No.: US07352574B2Publication Date: 2008-04-01
- Inventor: Jui-Lin Chen
- Applicant: Jui-Lin Chen
- Applicant Address: TW
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW
- Agency: Edwards Angell Palmer & Dodge LLP
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW94209908U 20050614
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
An assembly and a heat-dissipating device having the same assembly are provided, in that tapped holes in fans of the heat-dissipating device are used with at least two columnar first fixing parts for mounting or detaching the heat-dissipating device with the need for extra tools. Accordingly, problems in the prior art may be solved.
Public/Granted literature
- US20060279929A1 Assembly and heat-dissipating device having the same assembly Public/Granted day:2006-12-14
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