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US07354530B2 Chemical mechanical polishing systems and methods for their use 有权
化学机械抛光系统及其使用方法

  • Patent Title: Chemical mechanical polishing systems and methods for their use
  • Patent Title (中): 化学机械抛光系统及其使用方法
  • Application No.: US11033068
    Application Date: 2005-01-10
  • Publication No.: US07354530B2
    Publication Date: 2008-04-08
  • Inventor: Shumin Wang , Vlasta Brusic Kaufman
  • Applicant: Shumin Wang , Vlasta Brusic Kaufman
  • Agent Thomas E. Omholt; Steven Weseman
  • Main IPC: C09K13/00
  • IPC: C09K13/00
Chemical mechanical polishing systems and methods for their use
Abstract:
Alpha-amino acid containing chemical mechanical polishing compositions and slurries that are useful for polishing substrates including multiple layers of metals, or metals and dielectrics.
Abstract(Chinese):

含有α-氨基酸的化学机械抛光组合物和浆料，其可用于抛光包括多层金属或金属和电介质的基底。

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