发明授权
- 专利标题: Method for forming adhesive layer
- 专利标题(中): 形成粘合剂层的方法
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申请号: US10559435申请日: 2004-06-02
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公开(公告)号: US07354621B2公开(公告)日: 2008-04-08
- 发明人: Osamu Itatani , Masato Sagawa
- 申请人: Osamu Itatani , Masato Sagawa
- 申请人地址: JP Kyoto
- 专利权人: Intermetallics Co., Ltd.
- 当前专利权人: Intermetallics Co., Ltd.
- 当前专利权人地址: JP Kyoto
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2003-161500 20030606
- 国际申请: PCT/JP2004/007626 WO 20040602
- 国际公布: WO2004/108304 WO 20041216
- 主分类号: B05D5/10
- IPC分类号: B05D5/10 ; B05D1/28
摘要:
In a method for forming an adhesive layer on the surface of a workpiece before the formation of a coating film containing a powder on the workpiece, the present invention provides a method for forming the adhesive layer having a desired thickness. This object is achieved by the following method: An adhesive layer formation medium m1 coated with an adhesive material is made to collide with a workpiece W so that the adhesive material is transferred from the adhesive layer formation medium m1 to the workpiece W and forms an adhesive layer on the workpiece. An adhesive layer having a desired thickness can be formed on the workpiece by regulating the thickness of the adhesive material applied to the surface of the adhesive layer formation medium (i.e. the amount of the adhesive material held by a single adhesive layer formation medium). This enables the thickness of the powder coating as the final product to be controlled as desired.
公开/授权文献
- US20060134319A1 Adhesive layer forming method 公开/授权日:2006-06-22
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