发明授权
- 专利标题: Printed conductive connectors
- 专利标题(中): 印刷导电连接器
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申请号: US11062019申请日: 2005-02-18
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公开(公告)号: US07354794B2公开(公告)日: 2008-04-08
- 发明人: Frank E. Anderson , Richard E. Corley, Jr. , Paul T. Spivey , Carl E. Sullivan
- 申请人: Frank E. Anderson , Richard E. Corley, Jr. , Paul T. Spivey , Carl E. Sullivan
- 申请人地址: US KY Lexington
- 专利权人: Lexmark International, Inc.
- 当前专利权人: Lexmark International, Inc.
- 当前专利权人地址: US KY Lexington
- 代理机构: Luedeka, Neely & Graham, PC
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
Methods of connecting a circuit device to a semiconductor substrate and micro-fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.
公开/授权文献
- US20060187267A1 Printed conductive connectors 公开/授权日:2006-08-24