Invention Grant
- Patent Title: Method for installing refrigeration device, and refrigeration device
- Patent Title (中): 制冷装置的安装方法及制冷装置
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Application No.: US10573984Application Date: 2004-10-21
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Publication No.: US07357002B2Publication Date: 2008-04-15
- Inventor: Manabu Yoshimi , Nobuki Matsui , Hiromume Matsuoka , Kazuhide Mizutani
- Applicant: Manabu Yoshimi , Nobuki Matsui , Hiromume Matsuoka , Kazuhide Mizutani
- Applicant Address: JP Osaka
- Assignee: Daikin Industries, Ltd.
- Current Assignee: Daikin Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Global IP Counselors
- Priority: JP2003-361827 20031022
- International Application: PCT/JP2004/015593 WO 20041021
- International Announcement: WO2005/038360 WO 20050428
- Main IPC: F25B43/04
- IPC: F25B43/04

Abstract:
An air conditioning device has a heat source unit and a utilization unit connected via a refrigerant connection pipe to form a refrigerant circuit, and has a cooler, a secondary receiver, and a separation membrane device. The cooler cools at least a portion of the refrigerant that flows through the liquid-side refrigerant circuit as the compressor is operated and the refrigerant in the refrigerant circuit is recirculated. The secondary receiver separates the refrigerant cooled by the cooler into a liquid refrigerant and a gas refrigerant that includes non-condensable gas. The separation membrane device has a separation membrane for separating the non-condensable gas from the gas refrigerant obtained by gas-liquid separation, and discharges the non-condensable gas thus separated to the outside of the refrigerant circuit.
Public/Granted literature
- US20070113581A1 Method for installing refrigeration device, and refrigeration device Public/Granted day:2007-05-24
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