Invention Grant
- Patent Title: Sandwich housing for an antenna amplifier
- Patent Title (中): 天线放大器的三明治外壳
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Application No.: US10928751Application Date: 2004-08-27
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Publication No.: US07358438B2Publication Date: 2008-04-15
- Inventor: Ortwin Zoller
- Applicant: Ortwin Zoller
- Applicant Address: DE Neckartenzlingen
- Assignee: Hirschmann Electronics GmbH & Co. KG
- Current Assignee: Hirschmann Electronics GmbH & Co. KG
- Current Assignee Address: DE Neckartenzlingen
- Agent Andrew Wilford
- Priority: DE10340257 20030829; DE102004011032 20040306
- Main IPC: H02G3/08
- IPC: H02G3/08
Abstract:
An antenna amplifier has its printed circuit board clamped between upper and lower housing parts which have peripheral edges raised to engage the periphery of the circuit board between them. A recess in the housing part can clear a plug connector on the circuit board. Resilient catches can connect the housing parts to apply pressure on the circuit board.
Public/Granted literature
- US20050048850A1 Sandwich housing for an antenna amplifier Public/Granted day:2005-03-03
Information query
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