发明授权
- 专利标题： Photo-coupler semiconductor device and production method therefor
- 专利标题（中）： 光耦合器半导体器件及其制造方法
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申请号： US10747403申请日： 2003-12-30
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公开(公告)号： US07358535B2公开(公告)日： 2008-04-15
- 发明人: Hiroyuki Shoji , Hideya Takakura , Kazuo Kusuda
- 申请人： Hiroyuki Shoji , Hideya Takakura , Kazuo Kusuda
- 申请人地址： JP Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JP Osaka
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2003-009991 20030117; JP2003-321627 20030912
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A photo-coupler semiconductor device includes first and second planar lead frames each having a main portion and a distal portion, a light emitting element and a light receiving element respectively mounted on upper surfaces of the distal portions of the first and second lead frames, a light-transmitting resin member which covers the light emitting element and the light receiving element, and supports the distal portions of the first and second lead frames in spaced opposed relation with the light emitting element and the light receiving element being mounted on the upper surfaces of the distal portions so that the main portions of the first and second lead frames are located in coplanar relation, and a opaque resin member which covers the light-transmitting resin member, and supports the main portions of the first and second lead frames. The light-transmitting resin member and the opaque resin member are each composed of an epoxy resin as a base resin.
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