Invention Grant
- Patent Title: Semiconductor force sensor
- Patent Title (中): 半导体力传感器
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Application No.: US11763844Application Date: 2007-06-15
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Publication No.: US07360440B2Publication Date: 2008-04-22
- Inventor: Shigeru Hirose , Hiroyuki Sawamura , Masato Ando , Yoshimitsu Motoki
- Applicant: Shigeru Hirose , Hiroyuki Sawamura , Masato Ando , Yoshimitsu Motoki
- Applicant Address: JP Kami-Niikawagun
- Assignee: Hokuriku Electric Industry Co., Ltd.
- Current Assignee: Hokuriku Electric Industry Co., Ltd.
- Current Assignee Address: JP Kami-Niikawagun
- Agency: Rankin, Hill & Clark LLP
- Main IPC: G01B7/16
- IPC: G01B7/16

Abstract:
A semiconductor force sensor capable of preventing a diaphragm part from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part, wherein a force transmitting device for applying a measured force to the diaphragm part of a semiconductor force sensor element is formed of a sphere having a rigidity, and a through hole passing through an opposed wall part toward the diaphragm is formed in the opposed wall parts at a position opposed to the center part of the diaphragm part so that a part of the sphere can face the outside of the opposed wall part and stores a part of the remaining part of the sphere to allow the sphere to be moved only in a direction orthogonal to the diaphragm part and rotated on the center part of the diaphragm part.
Public/Granted literature
- US20070234827A1 SEMICONDUCTOR FORCE SENSOR Public/Granted day:2007-10-11
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