发明授权
US07361585B2 System for and method of planarizing the contact region of a via by use of a continuous inline vacuum deposition
有权
通过使用连续在线真空沉积来平坦化通孔的接触区域的系统和方法
- 专利标题： System for and method of planarizing the contact region of a via by use of a continuous inline vacuum deposition
- 专利标题（中）： 通过使用连续在线真空沉积来平坦化通孔的接触区域的系统和方法
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申请号： US11044140申请日： 2005-01-27
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公开(公告)号： US07361585B2公开(公告)日： 2008-04-22
- 发明人: Thomas P. Brody , Joseph A. Marcanio
- 申请人： Thomas P. Brody , Joseph A. Marcanio
- 申请人地址： VG Tortola
- 专利权人： Advantech Global, Ltd
- 当前专利权人： Advantech Global, Ltd
- 当前专利权人地址： VG Tortola
- 代理机构： The Webb Law Firm
- 主分类号： H01L21/4763
- IPC分类号： H01L21/4763 ; H01L21/36 ; H01L21/20 ; H01L21/336
摘要：
A multi-layer electronic device can be formed to include an insulative substrate (212), a first vapor deposited conductor layer (312) on the insulative substrate (212), a first vapor deposited insulator layer (314) on the first conductor layer (312), the first insulator layer (314) having at least one via hole (316) therein, and a vapor deposited conductive filler (320) in the via hole (316) of the first insulator layer (314). Desirably, the conductive filler (320) is deposited in the via hole (316) of the first insulator layer (314) such that the surface of the conductive filler (320) opposite the first conductor layer (312) is substantially planar with the surface of the first insulator layer (314) opposite the first conductor layer (312).
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