发明授权
US07361718B2 Alkali-soluble gap fill material forming composition for lithography
有权
用于光刻的碱溶性间隙填充材料形成组合物
- 专利标题: Alkali-soluble gap fill material forming composition for lithography
- 专利标题(中): 用于光刻的碱溶性间隙填充材料形成组合物
-
申请号: US10540389申请日: 2003-12-25
-
公开(公告)号: US07361718B2公开(公告)日: 2008-04-22
- 发明人: Satoshi Takei , Kazuhisa Ishii , Shinya Arase
- 申请人: Satoshi Takei , Kazuhisa Ishii , Shinya Arase
- 申请人地址: JP Tokyo
- 专利权人: Nissan Chemical Industries, Ltd.
- 当前专利权人: Nissan Chemical Industries, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2002-376781 20021226
- 国际申请: PCT/JP03/16735 WO 20031225
- 国际公布: WO2004/061526 WO 20040722
- 主分类号: C08F212/02
- IPC分类号: C08F212/02 ; C08F20/06
摘要:
There is provided a gap fill material forming composition for lithography that is used in dual damascene process and contributes toward an improvement in production efficiency. Concretely, it is a gap fill material forming composition characterized in that the composition is used in manufacture of semiconductor device by a method comprising coating a photoresist on a substrate having a hole with aspect ratio shown in height/diameter of 1 or more, and transferring an image to the substrate by use of lithography process, and that the composition is coated on the substrate prior to coating of the photoresist, and comprises a polymer having a hydroxy group or a carboxy group and a crosslinking agent. The gap fill material layer obtained from the gap fill material forming composition can be etched back with an alkaline aqueous solution.