发明授权
- 专利标题： Chuck with integrated wafer support
- 专利标题（中）： 带集成晶圆支架的卡盘
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申请号： US11655605申请日： 2007-01-19
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公开(公告)号： US07362115B2公开(公告)日： 2008-04-22
- 发明人: Peter Andrews , Brad Froemke , John Dunklee
- 申请人： Peter Andrews , Brad Froemke , John Dunklee
- 申请人地址： US OR Beaverton
- 专利权人： Cascade Microtech, Inc.
- 当前专利权人： Cascade Microtech, Inc.
- 当前专利权人地址： US OR Beaverton
- 代理机构： Chernoff, Vilhauer, McClung & Stenzel
- 主分类号： G01R31/02
- IPC分类号： G01R31/02
摘要：
An improved chuck assembly with lift pins. The chuck assembly may have an outer periphery and an upper surface. The lift pins may be positioned within the periphery of the chuck assembly and may be capable of relative vertical movement with respect to the upper surface of the chuck assembly.
公开/授权文献
- US20070115013A1 Chuck with integrated wafer support 公开/授权日：2007-05-24
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