Invention Grant
- Patent Title: Heat relief socket
- Patent Title (中): 散热插座
-
Application No.: US11400561Application Date: 2006-04-07
-
Publication No.: US07362584B2Publication Date: 2008-04-22
- Inventor: Steven J Millard , John F D'Ambrosia
- Applicant: Steven J Millard , John F D'Ambrosia
- Applicant Address: US PA Middletown
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Middletown
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat relief socket is provided where a contact carrier substrate is provided carrying a plurality of contacts, and is supported by a frame. The frame has an open area therethrough which can receive air flow to cool the bottom of a chip carried by the socket and the contacts themselves.
Public/Granted literature
- US20070236892A1 Heat relief socket Public/Granted day:2007-10-11
Information query
