发明授权
- 专利标题： Microcircuit cooling for vanes
- 专利标题（中）： 叶片微电路冷却
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申请号： US11286794申请日： 2005-11-23
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公开(公告)号： US07364405B2公开(公告)日： 2008-04-29
- 发明人: Frank Cunha , Matthew T. Dahmer
- 申请人： Frank Cunha , Matthew T. Dahmer
- 申请人地址： US CT Hartford
- 专利权人： United Technologies Corporation
- 当前专利权人： United Technologies Corporation
- 当前专利权人地址： US CT Hartford
- 代理机构： Bachman & LaPointe, P.C.
- 主分类号： F01D5/08
- IPC分类号： F01D5/08
摘要：
A turbine engine component has an airfoil portion with a suction side. The component includes a cooling microcircuit embedded within a wall structure forming the suction side. The cooling microcircuit has at least one cooling film hole positioned ahead of a gage point for creating a flow of cooling fluid over an exterior surface of the suction side which travels past the gage point. The cooling microcircuit is formed using refractory metal core technology. A method for forming the cooling microcircuit is described.
公开/授权文献
- US20070116569A1 Microcircuit cooling for vanes 公开/授权日：2007-05-24
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