发明授权
US07364799B2 Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board
有权
聚酰胺酰亚胺树脂,柔性金属包覆层压板和柔性印刷线路板
- 专利标题: Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board
- 专利标题(中): 聚酰胺酰亚胺树脂,柔性金属包覆层压板和柔性印刷线路板
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申请号: US10505697申请日: 2003-02-26
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公开(公告)号: US07364799B2公开(公告)日: 2008-04-29
- 发明人: Tomoharu Kurita , Shinji Suzuki , Cyuji Inukai
- 申请人: Tomoharu Kurita , Shinji Suzuki , Cyuji Inukai
- 申请人地址: JP Osaka
- 专利权人: Toyo Boseki Kabushiki Kaisha
- 当前专利权人: Toyo Boseki Kabushiki Kaisha
- 当前专利权人地址: JP Osaka
- 代理机构: Leydig, Voit & Mayer, Ltd.
- 优先权: JP2002-050167 20020226; JP2002-050168 20020226
- 国际申请: PCT/JP03/02163 WO 20030226
- 国际公布: WO03/072639 WO 20030904
- 主分类号: B32B27/34
- IPC分类号: B32B27/34
摘要:
The present invention provides a non-halogen polyamide-imide resin soluble in an amide solvent at a concentration of 10%, the resulting varnish, when stored at 5° C. for 1 month, exhibiting a solution viscosity change ((solution viscosity after 1 month−initial solution viscosity)/initial solution viscosity), expressed as an absolute value, of not greater than 3.0, and the resin having a moisture absorption (25° C., 90% RH, 24 hours) of not greater than 2.0%; a flexible metal-clad laminates using such a resin; and a flexible printed wiring board prepared from such a flexible metal-clad laminate by circuit formation. The flexible metal-clad laminate of the invention does not curl under any conditions, including humid conditions, and exhibits excellent dimensional stability since the heat resistant resin used as an insulation material has low moisture absorption and low thermal expansion coefficient and there is less internal stress in the flexible metal-clad laminate. Moreover, since the solder heat resistance and the insulation properties are not impaired even after humidification and since the heat resistant resin is soluble in organic solvents with high solution stability, the flexible metal-clad laminate of the invention can be inexpensively produced.