发明授权
- 专利标题: Method for manufacturing semiconductor device having super junction construction
- 专利标题(中): 具有超结构构造的半导体器件的制造方法
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申请号: US11356984申请日: 2006-02-21
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公开(公告)号: US07364971B2公开(公告)日: 2008-04-29
- 发明人: Hitoshi Yamaguchi , Mikimasa Suzuki , Yoshiyuki Hattori
- 申请人: Hitoshi Yamaguchi , Mikimasa Suzuki , Yoshiyuki Hattori
- 申请人地址: JP Kariya
- 专利权人: DENSO CORPORATION
- 当前专利权人: DENSO CORPORATION
- 当前专利权人地址: JP Kariya
- 代理机构: Posz Law Group, PLC
- 优先权: JP2003-179635 20030624
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A semiconductor device includes a body region, a drift region having a first part and a second part, and a trench gate electrode. The body region is disposed on the drift region. The first and second parts extend in an extending direction so that the second part is adjacent to the first part. The trench gate electrode penetrates the body region and reaches the drift region so that the trench gate electrode faces the body region and the drift region through an insulation layer. The trench gate electrode extends in a direction crossing with the extending direction of the first and second parts. The first part includes a portion near the trench gate electrode, which has an impurity concentration equal to or lower than that of the body region.
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