发明授权
US07365129B2 Polymer systems with reactive and fusible properties for solid freeform fabrication
有权
具有反应性和易熔性的聚合体系,用于固体自由形成
- 专利标题: Polymer systems with reactive and fusible properties for solid freeform fabrication
- 专利标题(中): 具有反应性和易熔性的聚合体系,用于固体自由形成
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申请号: US10686137申请日: 2003-10-14
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公开(公告)号: US07365129B2公开(公告)日: 2008-04-29
- 发明人: Laura Kramer , Vladek Kasperchik , Melissa D. Boyd
- 申请人: Laura Kramer , Vladek Kasperchik , Melissa D. Boyd
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 主分类号: C08L23/00
- IPC分类号: C08L23/00 ; C08L23/04 ; C08L25/02 ; C08L33/02 ; C08L33/04 ; C08L35/02 ; C08L37/00
摘要:
A powder system for use in solid freeform fabrication. The powder system includes at least one polymer having reactive properties and fusible properties. The at least one polymer is reactive with a liquid binder and is fusible at a temperature above the melting point or glass transition temperature of the at least one polymer. The at least one polymer may be a single co-polymer having at least one reactive portion and at least one fusible portion or may be a mixture of polymers including at least one reactive polymer and at least one fusible polymer. A method of forming an object by solid freeform fabrication is also disclosed.
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