发明授权
- 专利标题： Multi-level semiconductor module and method for fabricating the same
- 专利标题（中）： 多级半导体模块及其制造方法
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申请号： US11242904申请日： 2005-10-05
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公开(公告)号： US07365416B2公开(公告)日： 2008-04-29
- 发明人: Takeshi Kawabata , Motoaki Satou , Toshiyuki Fukuda , Toshio Tsuda , Kazuhiro Nobori , Seiichi Nakatani
- 申请人： Takeshi Kawabata , Motoaki Satou , Toshiyuki Fukuda , Toshio Tsuda , Kazuhiro Nobori , Seiichi Nakatani
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2004-364586 20041216
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A semiconductor module is formed by alternately stacking resin boards 3 on which semiconductor chips 2 are mounted and sheet members having openings larger than the semiconductor chips 2 and bonded to the resin boards 3. The resin board 4 located at the bottom out of the resin boards 3 is thicker than the other resin boards 3.
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