发明授权
- 专利标题： Heat dissipating device
- 专利标题（中）： 散热装置
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申请号： US11135593申请日： 2005-05-23
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公开(公告)号： US07365978B2公开(公告)日： 2008-04-29
- 发明人: Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
- 申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
- 申请人地址： CN Bao'an District, Shenzhen City, Guangdong Province TW Tu-Cheng City, Taipei Hsien
- 专利权人： Fu Zhun Precision Industry (Shenzhen) Co., Ltd.,Foxcomm Technology Co., Ltd.
- 当前专利权人： Fu Zhun Precision Industry (Shenzhen) Co., Ltd.,Foxcomm Technology Co., Ltd.
- 当前专利权人地址： CN Bao'an District, Shenzhen City, Guangdong Province TW Tu-Cheng City, Taipei Hsien
- 代理机构： Morris Manning Martin LLP
- 代理商 Tim Tingkang Xia, Esq.
- 优先权： CN200420102795U 20041211
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heat dissipating device includes a heat sink (60), a radiator (70) and heat-transfer pipes (80). The heat sink includes a chassis (62), a plate (64) separate from the chassis and a plurality of fins (66) extending between the chassis and the plate. The radiator includes a base (72) parallel to the fins. Each heat-transfer pipe includes a heat-absorbing portion (82) thermally positioned to the chassis, a heat-releasing portion (84) thermally positioned to the plate and a heat-transfer portion (86) disposed between the heat-absorbing portion and the heat-releasing portion. The heat-transfer portion is thermally received in the base of the radiator.
公开/授权文献
- US20060104036A1 Heat dissipating device 公开/授权日：2006-05-18
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