发明授权
- 专利标题： Gold CMP composition and method
- 专利标题（中）： 金CMP组成和方法
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申请号： US11444866申请日： 2006-05-31
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公开(公告)号： US07368066B2公开(公告)日： 2008-05-06
- 发明人: Vlasta Brusic , Renjie Zhou , Christopher Thompson
- 申请人： Vlasta Brusic , Renjie Zhou , Christopher Thompson
- 申请人地址： US IL Aurora
- 专利权人： Cabot Microelectronics Corporation
- 当前专利权人： Cabot Microelectronics Corporation
- 当前专利权人地址： US IL Aurora
- 代理商 Thomas E. Omholt; Steven D. Weseman; Robert J. Ross
- 主分类号： B44C1/22
- IPC分类号： B44C1/22
摘要：
The invention provides a cyanide-free chemical-mechanical polishing (CMP) composition useful for polishing a gold-containing surface of a substrate. The CMP composition comprises an abrasive, a gold-oxidizing agent, a cyanide-free gold-solubilizing agent, and an aqueous carrier therefor. The invention further provides a method of chemically-mechanically polishing a gold-containing surface of a substrate with the aforementioned polishing composition.
公开/授权文献
- US20070278184A1 Gold CMP composition and method 公开/授权日：2007-12-06
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