发明授权
- 专利标题: Armored plating system
- 专利标题(中): 装甲电镀系统
-
申请号: US11087082申请日: 2005-03-22
-
公开(公告)号: US07370567B2公开(公告)日: 2008-05-13
- 发明人: Dan Jones , Devane Clarke
- 申请人: Dan Jones , Devane Clarke
- 申请人地址: US TX Waco
- 专利权人: Rampgate, Ltd.
- 当前专利权人: Rampgate, Ltd.
- 当前专利权人地址: US TX Waco
- 代理机构: Fulbright & Jaworksi LLP
- 主分类号: F41H5/02
- IPC分类号: F41H5/02
摘要:
An improved armored plating system having a series of elongate tubes arranged in parallel fashion to form a protective array. Each tube has a rectilinear cross section with slanted sidewalls so that each tube partially overlaps the following tube and is partially overlapped by the previous tube. As such, the protective array may be placed on a curved surface while having no gaps in protection. The protective array is formed as alternating tubes slide past one another from opposing directions. A series of laminated members and an embossed member are slideably inserted into each tube and layered upon one another.
公开/授权文献
- US20080083323A1 ARMORED PLATING SYSTEM 公开/授权日:2008-04-10
信息查询