发明授权
- 专利标题： Connection structure of circuit substrate
- 专利标题（中）： 电路基板的连接结构
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申请号： US10877752申请日： 2004-06-25
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公开(公告)号： US07371071B2公开(公告)日： 2008-05-13
- 发明人: Sung-Dae Cho , Joo-Hyung Lee
- 申请人： Sung-Dae Cho , Joo-Hyung Lee
- 申请人地址： KR Suwon-si, Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si, Gyeonggi-do
- 代理机构： Marger Johnson & McCollom, P.C.
- 优先权： KR10-2003-0050203 20030722
- 主分类号： H01R12/00
- IPC分类号： H01R12/00
摘要：
The present invention provides an improved connection for circuit substrates. The circuit substrates are connected at concave and convex portions at their ends. The concave portion is formed such that the inside width is larger than the entrance width. The convex portion fits into the concave portion. Thereby, a connected portion of the circuit substrates has increased tensile strength. Furthermore, abnormality of the connected portion of the circuit substrates may be easily perceived.
公开/授权文献
- US20050016897A1 Connection structure of circuit substrate 公开/授权日：2005-01-27
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