Invention Grant
- Patent Title: Land grid array connector with reinforcement stiffener
- Patent Title (中): 带有加强筋的土地格栅阵列连接器
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Application No.: US11708720Application Date: 2007-02-20
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Publication No.: US07371098B2Publication Date: 2008-05-13
- Inventor: Qing-Feng Wang , Fu-Jin Peng
- Applicant: Qing-Feng Wang , Fu-Jin Peng
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Wei Te Chung
- Priority: CN200620069562 20060221
- Main IPC: H01R13/62
- IPC: H01R13/62
Abstract:
An electrical connector comprises an insulative housing (2), a plurality contacts (4) received therein, at least a pair of securing members (3) disposed on adjacent corners of housing (2). The securing members (3) are used for supporting a chip module and able to slide in an upright direction, which can solve the balance problem produced in process of mounting a heat sink.
Public/Granted literature
- US20070197077A1 Land grid array connector with reinforcement stiffener Public/Granted day:2007-08-23
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