Invention Grant
- Patent Title: Plating removing apparatus for two-piece wheel
- Patent Title (中): 两件式车轮电镀去除装置
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Application No.: US11499858Application Date: 2006-08-07
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Publication No.: US07371158B2Publication Date: 2008-05-13
- Inventor: Takeshi Tanaka
- Applicant: Takeshi Tanaka
- Applicant Address: JP Higashiosaka-shi
- Assignee: Work Co., Ltd.
- Current Assignee: Work Co., Ltd.
- Current Assignee Address: JP Higashiosaka-shi
- Agency: Kratz, Quintos & Hanson, LLP
- Priority: JP2005-230441 20050809; JP2006-155686 20060605
- Main IPC: B24B7/00
- IPC: B24B7/00

Abstract:
To provide a plating removing apparatus for 2-piece wheels, which can easily and beautifully remove plating at the welding planned portion on the rim inner circumferential surface and achieves 2-piece wheels with rims plated without requiring any troublesome operation, said apparatus comprising a pair of support rollers 13 horizontally arranged, a positioning member 15 that positions the rim 2 in the axial direction of the support roller 13, a pair of holding rollers 19 that hold the rim 2 between the support rollers 13 and the holding rollers 19, a rotation drive means that rotates and drives the rim 2 held between the support rollers 13 and holding rollers 19, and a grinding means that extends to an inside of the rim 2 for grinding the welding planned portion RW of the rim 2 with respect to the disk, and for removing plating of the relevant welding planned portion.
Public/Granted literature
- US20070037497A1 Plating removing apparatus for two-piece wheel Public/Granted day:2007-02-15
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