Invention Grant
US07371158B2 Plating removing apparatus for two-piece wheel 有权
两件式车轮电镀去除装置

  • Patent Title: Plating removing apparatus for two-piece wheel
  • Patent Title (中): 两件式车轮电镀去除装置
  • Application No.: US11499858
    Application Date: 2006-08-07
  • Publication No.: US07371158B2
    Publication Date: 2008-05-13
  • Inventor: Takeshi Tanaka
  • Applicant: Takeshi Tanaka
  • Applicant Address: JP Higashiosaka-shi
  • Assignee: Work Co., Ltd.
  • Current Assignee: Work Co., Ltd.
  • Current Assignee Address: JP Higashiosaka-shi
  • Agency: Kratz, Quintos & Hanson, LLP
  • Priority: JP2005-230441 20050809; JP2006-155686 20060605
  • Main IPC: B24B7/00
  • IPC: B24B7/00
Plating removing apparatus for two-piece wheel
Abstract:
To provide a plating removing apparatus for 2-piece wheels, which can easily and beautifully remove plating at the welding planned portion on the rim inner circumferential surface and achieves 2-piece wheels with rims plated without requiring any troublesome operation, said apparatus comprising a pair of support rollers 13 horizontally arranged, a positioning member 15 that positions the rim 2 in the axial direction of the support roller 13, a pair of holding rollers 19 that hold the rim 2 between the support rollers 13 and the holding rollers 19, a rotation drive means that rotates and drives the rim 2 held between the support rollers 13 and holding rollers 19, and a grinding means that extends to an inside of the rim 2 for grinding the welding planned portion RW of the rim 2 with respect to the disk, and for removing plating of the relevant welding planned portion.
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