发明授权
- 专利标题: Method of fabricating light emitting diode package
- 专利标题(中): 制造发光二极管封装的方法
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申请号: US11439189申请日: 2006-05-24
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公开(公告)号: US07371603B2公开(公告)日: 2008-05-13
- 发明人: Yong Suk Kim , Seog Moon Choi , Hyoung Ho Kim , Yong Sik Kim
- 申请人: Yong Suk Kim , Seog Moon Choi , Hyoung Ho Kim , Yong Sik Kim
- 申请人地址: KR Kyungki-Do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Kyungki-Do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2005-0044519 20050526
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/50 ; H01L21/48 ; H01L21/44
摘要:
The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.
公开/授权文献
- US20060270078A1 Method of fabricating light emitting diode package 公开/授权日:2006-11-30