发明授权
- 专利标题: Thin film transistor array panel and fabrication
- 专利标题(中): 薄膜晶体管阵列和制造
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申请号: US11486330申请日: 2006-07-12
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公开(公告)号: US07371621B2公开(公告)日: 2008-05-13
- 发明人: Sang-Gab Kim , Woo-Geun Lee , Shi-Yul Kim , Jin-Ho Ju , Jang-Soo Kim , Sang-Woo Whangbo , Min-Seok Oh , Hye-Young Ryu , Hong-Kee Chin
- 申请人: Sang-Gab Kim , Woo-Geun Lee , Shi-Yul Kim , Jin-Ho Ju , Jang-Soo Kim , Sang-Woo Whangbo , Min-Seok Oh , Hye-Young Ryu , Hong-Kee Chin
- 申请人地址: KR Gyeonggi-Do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-Do
- 代理机构: MacPherson Kwok Chen & Heid LLP
- 代理商 Mark Pellegrini
- 优先权: KR10-2005-0062730 20050712
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas.
公开/授权文献
- US20070012967A1 Thin film transistor array panel and fabrication 公开/授权日:2007-01-18
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