Invention Grant
- Patent Title: Method for producing a transistor structure
- Patent Title (中): 晶体管结构的制造方法
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Application No.: US10532894Application Date: 2003-10-24
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Publication No.: US07371650B2Publication Date: 2008-05-13
- Inventor: Josef Böck , Rudolf Lachner , Thomas Meister , Reinhard Stengl , Herbert Schäfer , Martin Seck
- Applicant: Josef Böck , Rudolf Lachner , Thomas Meister , Reinhard Stengl , Herbert Schäfer , Martin Seck
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agency: Brinks Hofer Gilson & Lione
- Priority: DE10250204 20021028
- International Application: PCT/DE03/03552 WO 20031024
- International Announcement: WO2004/040643 WO 20040513
- Main IPC: H01L21/331
- IPC: H01L21/331

Abstract:
A method for fabricating a transistor structure with a first and a second bipolar transistor having different collector widths is presented. The method includes providing a semiconductor substrate, introducing a first buried layer of the first bipolar transistor and a second buried layer of the second bipolar transistor into the semiconductor substrate, and producing at least a first collector region having a first collector width on the first buried layer and a second collector region having a second collector width on the second buried layer. A first collector zone having a first thickness is produced on the second buried layer for production of the second collector width. A second collector zone having a second thickness is produced on the first collector zone. At least one insulation region is produced that isolates at least the collector regions from one another.
Public/Granted literature
- US20060009002A1 Method for producing a transistor structure Public/Granted day:2006-01-12
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