Invention Grant
US07372083B2 Embedded silicon-controlled rectifier (SCR) for HVPMOS ESD protection
有权
嵌入式可控硅整流器(SCR),用于HVPMOS ESD保护
- Patent Title: Embedded silicon-controlled rectifier (SCR) for HVPMOS ESD protection
- Patent Title (中): 嵌入式可控硅整流器(SCR),用于HVPMOS ESD保护
-
Application No.: US11199662Application Date: 2005-08-09
-
Publication No.: US07372083B2Publication Date: 2008-05-13
- Inventor: Jian-Hsing Lee , Yu-Chang Jong
- Applicant: Jian-Hsing Lee , Yu-Chang Jong
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L29/72
- IPC: H01L29/72

Abstract:
A high voltage p-type metal oxide semiconductor (HVPMOS) device having electrostatic discharge (ESD) protection functions and a method of forming the same are provided. The HVPMOS includes a PMOS transistor, wherein the PMOS transistor comprises a first source/drain region doped with a p-type impurity in a high voltage p-well (HVPW) region, a second source/drain region doped with a p-type impurity in a high voltage n-well (HVNW) region wherein the HVPW region and HVNW region physically contact each other, a field region substantially underlying a gate dielectric, and a first heavily doped n-type (N+) region in the HVPW region and contacting the first source/drain region. The device further includes an N+ buried layer underlying the HVPW region and the HVNW region and a p-type substrate underlying the N+ buried layer. The device has robust performance for both forward and reverse mode ESD.
Public/Granted literature
- US20070034956A1 Embedded silicon-controlled rectifier (SCR) for HVPMOS ESD protection Public/Granted day:2007-02-15
Information query
IPC分类: