发明授权
- 专利标题： Protective layers compatible with thick film pastes
- 专利标题（中）： 保护层与厚膜粘合剂兼容
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申请号： US10713606申请日： 2003-11-14
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公开(公告)号： US07374859B2公开(公告)日： 2008-05-20
- 发明人: Young H. Kim
- 申请人： Young H. Kim
- 申请人地址： US DE Wilmington
- 专利权人： E.I. du Pont de Nemours and Company
- 当前专利权人： E.I. du Pont de Nemours and Company
- 当前专利权人地址： US DE Wilmington
- 主分类号： G03F7/00
- IPC分类号： G03F7/00 ; G03F7/004
摘要：
This invention relates to novel processes comprising a protective polymer layer in the fabrication of electronic devices using thick film pastes. The protective polymer layer is fabricated from materials which are insoluble after irradiation in the ester-type solvents contained in the thick film paste. By appropriate selection of protective film polymers, the protective film can be compatible with the thick film paste.
公开/授权文献
- US20040137364A1 Protective layers compatible with thick film pastes 公开/授权日：2004-07-15
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