发明授权
US07375428B2 Flip-chip bonding structure using multi chip module-deposited substrate
有权
使用多芯片模块沉积衬底的倒装键合结构
- 专利标题： Flip-chip bonding structure using multi chip module-deposited substrate
- 专利标题（中）： 使用多芯片模块沉积衬底的倒装键合结构
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申请号： US11302635申请日： 2005-12-14
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公开(公告)号： US07375428B2公开(公告)日： 2008-05-20
- 发明人: Kwang-Seok Seo , Sang-Sub Song
- 申请人： Kwang-Seok Seo , Sang-Sub Song
- 申请人地址： KR Seoul
- 专利权人： Seoul National University Industry Foundation
- 当前专利权人： Seoul National University Industry Foundation
- 当前专利权人地址： KR Seoul
- 代理机构： Thomas, Kayden, Horstemeyer & Risley
- 优先权： KR10-2005-0001536 20050701
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
Flip-chip bonding structures using an MCM-D substrate are disclosed. A flip-chip bonding structure using an MCM-D substrate includes: a silicon substrate, a Si-bump disposed at a predetermined position of the silicon substrate, wherein a material of the Si-bump is the same as the silicon substrate, a dielectric layer disposed on the silicon substrate and a transmission line formed on the Si-bump to connect to a circuit formed on the dielectric layer.
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