Invention Grant
- Patent Title: Grinding method and apparatus
- Patent Title (中): 研磨方法和装置
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Application No.: US11454932Application Date: 2006-06-19
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Publication No.: US07376482B2Publication Date: 2008-05-20
- Inventor: Masahiro Ido
- Applicant: Masahiro Ido
- Applicant Address: JP Osaka-shi
- Assignee: Jtekt Corporation
- Current Assignee: Jtekt Corporation
- Current Assignee Address: JP Osaka-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
- Priority: JP2005-181144 20050621
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
In a grinding method and apparatus, a machining portion of a workpiece is ground with a grinding wheel on a trial, and shape errors in respective rotational phases of the machining portion are measured after the trial grinding. Based on the shape errors, control data defining workpiece rotational speeds for respective rotational phases of the workpiece is prepared so that the workpiece rotational speed is made to be slow for a rotational phase in which the machining portion is undercut, but to be fast for another rotational phase in which the machining portion is overcut, and the machining portion of the workpiece is ground as the rotational speed of the workpiece is controlled in accordance with the control data.
Public/Granted literature
- US20060287756A1 Grinding method and apparatus Public/Granted day:2006-12-21
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