发明授权
- 专利标题: Heating apparatus
- 专利标题(中): 加热装置
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申请号: US11444118申请日: 2006-05-31
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公开(公告)号: US07377775B2公开(公告)日: 2008-05-27
- 发明人: Hideki Ogawa
- 申请人: Hideki Ogawa
- 申请人地址: JP
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP
- 代理机构: Knobbe Martens Olson & Bear, LLP
- 优先权: JP2005-160612 20050531
- 主分类号: F27B9/02
- IPC分类号: F27B9/02
摘要:
According to one embodiment, a heating apparatus includes, a heating chamber, a fan provided in the heating chamber, the fan blowing atmosphere upward, a heater provided in the heating chamber and above the fan, the heater heating the atmosphere blown by the fan, a plurality of first straightening vanes arranged in a substantially horizontal direction so as to be spaced apart from one another in the heating chamber and above the heater, a plurality of second straightening vanes arranged in a substantially horizontal direction so as to be spaced apart from one another in the heating chamber and above the first straightening vanes, each of the plurality of second straightening vanes overlapping both of its adjacent first straightening vanes, and a transfer unit which transfers a board, at least part of the transfer unit being provided in the heating chamber and located above the second straightening vanes.
公开/授权文献
- US20060269888A1 Heating apparatus 公开/授权日:2006-11-30