发明授权
- 专利标题： Positive type photosensitive epoxy resin composition and printed circuit board using the same
- 专利标题（中）： 正型感光环氧树脂组合物和使用其的印刷电路板
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申请号： US11471871申请日： 2006-06-21
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公开(公告)号： US07378228B2公开(公告)日： 2008-05-27
- 发明人: Yasuaki Sugano , Yasuharu Nojima
- 申请人： Yasuaki Sugano , Yasuharu Nojima
- 申请人地址： US TX The Woodlands
- 专利权人： Huntsman Advanced Materials Americas Inc.
- 当前专利权人： Huntsman Advanced Materials Americas Inc.
- 当前专利权人地址： US TX The Woodlands
- 优先权： EP00811080 20001115
- 主分类号： G03F7/40
- IPC分类号： G03F7/40
摘要：
A printed circuit board comprising an insulating layer prepared with the aid of a positive type photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule; (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent, and (d) a photosensitive acid generator.
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