发明授权
- 专利标题： Printed circuit board with embedded capacitors therein and manufacturing process thereof
- 专利标题（中）： 具有嵌入式电容器的印刷电路板及其制造方法
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申请号： US11365219申请日： 2006-02-28
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公开(公告)号： US07378326B2公开(公告)日： 2008-05-27
- 发明人: Jin Yong Ahn , Cheol Seong Hwang , Sung Kun Kim , Chang Sup Ryu , Suk Hyeon Cho , Ho Sik Jeon
- 申请人： Jin Yong Ahn , Cheol Seong Hwang , Sung Kun Kim , Chang Sup Ryu , Suk Hyeon Cho , Ho Sik Jeon
- 申请人地址： KR Gyeonggi-do
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Darby & Darby P.C.
- 优先权： KR10-2005-0017333 20050302
- 主分类号： H01L21/20
- IPC分类号： H01L21/20 ; H05K3/30
摘要：
A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.
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