发明授权
- 专利标题: Mold
- 专利标题(中): 模子
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申请号: US11581447申请日: 2006-10-17
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公开(公告)号: US07381047B2公开(公告)日: 2008-06-03
- 发明人: Noriko Eiha , Seiichi Watanabe
- 申请人: Noriko Eiha , Seiichi Watanabe
- 申请人地址: JP Tokyo
- 专利权人: FUJIFILM Corporation
- 当前专利权人: FUJIFILM Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JP2005-301143 20051017
- 主分类号: B29C45/26
- IPC分类号: B29C45/26 ; B29C33/30
摘要:
A mold capable of preventing deterioration of the mold even when a material for spherical members is harder than that for the mold, and capable of aligning the center axis between an insert member and a body member thereof with high accuracy even when a pressure of resin filling is applied. The mold has an insert member with a cavity surface, and a body member for supporting the insert member from outside via a plurality of spherical members. Tubular liners harder than the spherical members are provided between the body member and the spherical members and between the insert member and the spherical members.
公开/授权文献
- US20070087068A1 Mold 公开/授权日:2007-04-19
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