Invention Grant
- Patent Title: Dielectric thin film, dielectric thin film device, and method of production thereof
- Patent Title (中): 介电薄膜,介电薄膜器件及其制造方法
-
Application No.: US11236724Application Date: 2005-09-28
-
Publication No.: US07382013B2Publication Date: 2008-06-03
- Inventor: Kiyoshi Uchida , Kenji Horino , Hitoshi Saita
- Applicant: Kiyoshi Uchida , Kenji Horino , Hitoshi Saita
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2004-287971 20040930
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
To provide a dielectric thin with a high dielectric constant, a low leakage current, and stable physical properties and electrical properties and to provide a thin film capacitor or other thin film dielectric device with a high capacitance and high reliability and a method of production of the same, a dielectric thin film containing oxides such as barium strontium titanate expressed by the formula (BaxSr(1-x))aTiO3 (0.5
Public/Granted literature
- US20060071263A1 Dielectric thin film, dielectric thin film device, and method of production thereof Public/Granted day:2006-04-06
Information query
IPC分类: