发明授权
- 专利标题： Heat dissipation device
- 专利标题（中）： 散热装置
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申请号： US11306412申请日： 2005-12-27
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公开(公告)号： US07382047B2公开(公告)日： 2008-06-03
- 发明人: Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
- 申请人： Chun-Chi Chen , Shi-Wen Zhou , Zhan Wu
- 申请人地址： unknown Longhua Town, Bao'an District, Shenzhen, Guangdong Province, P.R.C. TW Tu-Cheng, Taipei Hsien
- 专利权人： Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- 当前专利权人： Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- 当前专利权人地址： unknown Longhua Town, Bao'an District, Shenzhen, Guangdong Province, P.R.C. TW Tu-Cheng, Taipei Hsien
- 代理商 Winston Hsu
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; B23P6/00 ; F28F27/00 ; H01B7/42
摘要：
A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.
公开/授权文献
- US20070145572A1 HEAT DISSIPATION DEVICE 公开/授权日：2007-06-28
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