Invention Grant
- Patent Title: Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
- Patent Title (中): 电容/电阻装置，有机介电层压板和包含这种装置的印刷线路板及其制造方法
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Application No.: US10967781Application Date: 2004-10-18
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Publication No.: US07382627B2Publication Date: 2008-06-03
- Inventor: William J. Borland , G. Sidney Cox , David Ross McGregor
- Applicant: William J. Borland , G. Sidney Cox , David Ross McGregor
- Applicant Address: US DE Wilmington
- Assignee: E.I. du Pont de Nemours and Company
- Current Assignee: E.I. du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H05K1/18
- IPC: H05K1/18
Abstract:
A capacitive/resistive device provides both resistive and capacitive functions. The capacitive/resistive device may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability. Conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability.
Public/Granted literature
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