Invention Grant
- Patent Title: Methods for manufacturing ultrahard compacts
- Patent Title (中): 制造超硬压块的方法
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Application No.: US10858662Application Date: 2004-06-01
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Publication No.: US07384592B2Publication Date: 2008-06-10
- Inventor: Christopher H. Weis , Ronald K. Eyre , Stewart N. Middlemiss , David Iverson
- Applicant: Christopher H. Weis , Ronald K. Eyre , Stewart N. Middlemiss , David Iverson
- Applicant Address: US TX Houston
- Assignee: Smith International, Inc
- Current Assignee: Smith International, Inc
- Current Assignee Address: US TX Houston
- Agent Y. Renee Alsandor
- Main IPC: C04B35/52
- IPC: C04B35/52 ; C04B35/5831

Abstract:
A method for manufacturing an ultrahard compact includes assembling a mass of ultrahard material with a mass of substrate material such that the mass of ultrahard material extends radially outward a greater extent than the substrate material to compensate for a difference in the radial shrinkage of the ultrahard material compared to the substrate material during a sintering process. The method may further includes subjecting the assembled compact to a high pressure high temperature process that results in the forming of an ultrahard compact including an ultrahard layer integrally bonded with a substrate.
Public/Granted literature
- US20050263944A1 Methods for manufacturing ultrahard compacts Public/Granted day:2005-12-01
Information query
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