发明授权
- 专利标题： Structure for determining thermal cycle reliability
- 专利标题（中）： 确定热循环可靠性的结构
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申请号： US11502196申请日： 2006-08-10
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公开(公告)号： US07388224B2公开(公告)日： 2008-06-17
- 发明人: Ronald Gene Filippi , Jason Paul Gill , Vincent J. McGahay , Paul Stephen McLaughlin , Conal Eugene Murray , Hazara Singh Rathore , Thomas M. Shaw , Ping-Chuan Wang
- 申请人： Ronald Gene Filippi , Jason Paul Gill , Vincent J. McGahay , Paul Stephen McLaughlin , Conal Eugene Murray , Hazara Singh Rathore , Thomas M. Shaw , Ping-Chuan Wang
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： Keusey, Tutunjian & Bitetto, P.C.
- 代理商 Robert M. Trepp, Esq.
- 主分类号： H01L23/58
- IPC分类号： H01L23/58
摘要：
A device and method for evaluating reliability of a semiconductor chip structure built by a manufacturing process includes a test structure built in accordance with a manufacturing process. The test structure is thermal cycled and the yield of the test structure is measured. The reliability of the semiconductor chip structure built by the manufacturing process is evaluated based on the yield performance before the thermal cycling.