A method for manufacturing a printing plate is realizes a precise and fine pattern by minimizing a variation of etching critical dimension. The method includes forming a hard mask having an opening on an insulating substrate; forming a first trench having a first depth in the insulating substrate using the hard mask; coating, patterning and developing a first photoresist over an entire surface of the insulating substrate including the hard mask; and forming at least a second trench having a second depth in the insulating substrate using the hard mask, wherein the second depth is deeper than the first depth.