Invention Grant
US07390978B2 Overmolded electronic assembly and overmoldable interface component
失效
包覆成型的电子组件和包覆模制接口部件
- Patent Title: Overmolded electronic assembly and overmoldable interface component
- Patent Title (中): 包覆成型的电子组件和包覆模制接口部件
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Application No.: US11021429Application Date: 2004-12-23
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Publication No.: US07390978B2Publication Date: 2008-06-24
- Inventor: Timothy B. Dean , Daniel T. Rooney , Jeffrey M. Petsinger
- Applicant: Timothy B. Dean , Daniel T. Rooney , Jeffrey M. Petsinger
- Applicant Address: US IL Schaumburg
- Assignee: Motorola, Inc.
- Current Assignee: Motorola, Inc.
- Current Assignee Address: US IL Schaumburg
- Agent James A. Lamb; Valerie M. Davis; Anthony P. Curtis
- Main IPC: H01L23/28
- IPC: H01L23/28

Abstract:
An overmolded electronic assembly (900, 1000, 1200) is fabricated from one or more overmoldable interface components (300, 400, 500, 1220, 1750) that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.
Public/Granted literature
- US20060141828A1 Overmolded electronic assembly and overmoldable interface component Public/Granted day:2006-06-29
Information query
IPC分类: