Invention Grant
US07390978B2 Overmolded electronic assembly and overmoldable interface component 失效
包覆成型的电子组件和包覆模制接口部件

Overmolded electronic assembly and overmoldable interface component
Abstract:
An overmolded electronic assembly (900, 1000, 1200) is fabricated from one or more overmoldable interface components (300, 400, 500, 1220, 1750) that may be electrical contacts or electronic components that have physical interfaces, such as speakers or sensors. The overmoldable interface components have a sacrificial end that is cut off from the remainder of the overmoldable interface components after being overmolded in an electronic assembly, providing a sealed cavity into the overmolded electronic assembly.
Information query
Patent Agency Ranking
0/0