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发明授权
US07391114B2 Electrode pad section for external connection 有权
电极焊盘部分用于外部连接

Electrode pad section for external connection
摘要：
A pad section serving as an electrode for external connection of a semiconductor device includes a first pad metal (61) formed in the top layer, a second pad metal (62) formed under the first pad metal (61) via an interlayer insulating film (71), and vias (63) which penetrate the interlayer insulating film (71) and electrically connect the first pad metal (61) and the second pad metal (62). The first pad metal (61) and the second pad metal (62) have edges displaced from each other so as not to be aligned with each other along the thickness direction of each layer. Thus, it is possible to reduce stress occurring on an edge of the second pad metal (62), thereby reducing damage on the interlayer insulating film (71) and so on.
摘要（中）：

用作半导体器件的外部连接用电极的焊盘部分包括形成在顶层中的第一焊盘金属（61），经由层间绝缘膜形成在第一焊盘金属（61）下面的第二焊盘金属（62） 71）和穿过层间绝缘膜（71）并使第一焊盘金属（61）和第二焊盘金属（62）电连接的通孔（63）。 第一焊盘金属（61）和第二焊盘金属（62）具有沿着各层的厚度方向彼此不相对的边缘。 因此，可以减少在第二焊盘金属（62）的边缘产生的应力，从而减少对层间绝缘膜（71）的损坏等。

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