Invention Grant
- Patent Title: Heat-dissipating device and a housing thereof
- Patent Title (中): 散热装置及其壳体
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Application No.: US11511985Application Date: 2006-08-28
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Publication No.: US07391611B2Publication Date: 2008-06-24
- Inventor: Hao-wen Ko , Tsung-Yu Lei , Kuo-cheng Lin , Hsiou-chen Chang
- Applicant: Hao-wen Ko , Tsung-Yu Lei , Kuo-cheng Lin , Hsiou-chen Chang
- Applicant Address: TW
- Assignee: Delta Electronics, Inc.
- Current Assignee: Delta Electronics, Inc.
- Current Assignee Address: TW
- Agency: Martine Penilla & Gencarella, LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F04D29/52

Abstract:
A heat-dissipating device and a housing thereof. The housing includes a passage for guiding an air stream flowing from an opening to another opening, wherein an sidewall of the passage at least one of the opening sides extends radially outwards with a rotational axis of the heat-dissipating device or the passage so as to enlarge intake or discharge area for the air streams. Accordingly, the intake airflow rate may be greatly increased and the heat-dissipating efficiency of the heat-dissipating device may be greatly enhanced without changing assembling conditions with other elements.
Public/Granted literature
- US20060285295A1 Heat-dissipating device and a housing thereof Public/Granted day:2006-12-21
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