Invention Grant
- Patent Title: Bending machine
- Patent Title (中): 折弯机
-
Application No.: US10531989Application Date: 2003-10-23
-
Publication No.: US07392678B2Publication Date: 2008-07-01
- Inventor: Yoshiaki Niwa , Hidekatsu Ikeda , Takahiro Shibata
- Applicant: Yoshiaki Niwa , Hidekatsu Ikeda , Takahiro Shibata
- Applicant Address: JP Kanagawa
- Assignee: Amada Company, Limiited
- Current Assignee: Amada Company, Limiited
- Current Assignee Address: JP Kanagawa
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2002-308988 20021023; JP2003-357269 20031017
- International Application: PCT/JP03/13550 WO 20031023
- International Announcement: WO2004/037457 WO 20040506
- Main IPC: B21D5/02
- IPC: B21D5/02 ; B23D37/14

Abstract:
A bending machine has an upper table and a lower table. An input part is provided for inputting product information. A bending order determiner is provided for determining a bending order of the workpiece. A mold determiner is provided for determining the mold necessary for bending the workpiece. A layout determiner is provided for determining layout of the mold. A positioning information calculator is provided for calculating a position of the workpiece with respect to the mold determined by the layout determiner as work position information. A navigation member is provided for navigating a position of the workpiece to the operator by movement in the horizontal direction on the basis of the work position information calculated by the positioning information calculator.
Public/Granted literature
- US20060162408A1 Bending machine Public/Granted day:2006-07-27
Information query