Invention Grant
- Patent Title: Integrated thermal and electrical connection system for power devices
- Patent Title (中): 电力设备集成热电连接系统
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Application No.: US11219228Application Date: 2005-09-02
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Publication No.: US07393236B2Publication Date: 2008-07-01
- Inventor: Alex Thompson , Mark D. Korich , Mark L Selogie , Keming Chen
- Applicant: Alex Thompson , Mark D. Korich , Mark L Selogie , Keming Chen
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations, Inc.
- Current Assignee: GM Global Technology Operations, Inc.
- Current Assignee Address: US MI Detroit
- Main IPC: H01R13/00
- IPC: H01R13/00

Abstract:
An electrical system as described herein is suitable for use in an electric or hybrid vehicle. The electrical system includes electrical devices, such as power transistors, coupled to an electrically and thermally conductive bus bar. The respective nodes of the electrical devices are coupled to the bus bar such that the bus bar carries a combined signal generated by the electrical devices. The bus bar is also thermally coupled to a conduction heat transfer system, such as a liquid cooled cold plate. Thus, the bus bar functions as both an electrical conduit and a conduction-based heat sink for the electrical system.
Public/Granted literature
- US20070053163A1 Integrated thermal and electrical connection system for power devices Public/Granted day:2007-03-08
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