利索-全球专利检索

  1. 登录
  2. 注册
发明授权
US07394139B2 Optical modulator module package using flip-chip mounting technology 有权
光调制器模块封装采用倒装芯片安装技术

Optical modulator module package using flip-chip mounting technology
摘要：
Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.
摘要（中）：

本文公开了一种使用倒装芯片安装技术的光调制器模块封装，其中使用倒装芯片安装技术将光调制器装置气密地安装。 光调制器装置被保护免受外部环境的影响，容易将电信号传输到外部，并且希望保持光调制器件的光学特性。

公开/授权文献
信息查询
Espacenet
0/0